浸镀;浸渍涂敷
Gilding and Tarnish-preventing Processes Gold imitation deposition by immersion plating
仿金镀与防变色工艺
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐,加入络合剂、光亮剂、锡盐稳定剂,研究成功了一种新的浸镀铜锡合金工艺。
Immersion plating of copper-tin alloy on steel and iron
钢铁浸镀铜锡合金工艺研究
The variance analyses show that the effect r of interaction between force bismuth and the temperature of immersion plating on growth of in~ ilies is mest remarkable.
经方差分析,结果表明,微量元素铋与热浸镀温度间的交互作用对化合物生长影响最显著;
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